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IEC 62047-25:2016

IEC 62047-25:2016

$43.55

Semiconductor devices – Micro-electromechanical devices – Part 25: Silicon based MEMS fabrication technology – Measurement method of pull-press and shearing strength of micro bonding area

Published By Publication Date Number of Pages
IEC 2016-08-29 50
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IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

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IEC 62047-25:2016
$43.55