{"id":233322,"date":"2024-10-19T15:12:24","date_gmt":"2024-10-19T15:12:24","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-62047-112013\/"},"modified":"2024-10-25T09:41:45","modified_gmt":"2024-10-25T09:41:45","slug":"bs-en-62047-112013","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-62047-112013\/","title":{"rendered":"BS EN 62047-11:2013"},"content":{"rendered":"
IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 micrometre and 1 mm and thickness between 0,1 micrometre and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material’s melting temperature.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 1 Scope 2 Normative References 3 Symbols and designations Tables Table 1 \u2013 Symbols and designations <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 4 Test piece 4.1 General 4.2 Shape of test piece 4.3 Test piece thickness Figures Figure 1 \u2013 Thin film test piece <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 4.4 In-plane type test piece 4.5 Out-of-plane type test piece 5 Testing method and test apparatus 5.1 Measurement principle 5.1.1 General <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 5.1.2 In-plane method 5.1.3 Out-of-plane method Figure 2 \u2013 CLTE measurement principles <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 5.2 Test apparatus 5.2.1 General 5.2.2 In-plane method 5.2.3 Out-of-plane method 5.3 Temperature measurement 5.4 In-plane test piece handling <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 5.5 Thermal strain measurement 5.6 Heating speed 5.7 Data analysis 5.7.1 General 5.7.2 Terminal-based calculation 5.7.3 Slope calculation by linear least squares method 6 Test report <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Annex A (informative) Test piece fabrication Figure A.1 \u2013 Schematic test piece fabrication process <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Annex B (informative) Test piece handling example Figure B.1 \u2013 Auxiliary jigs and a specimen example <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Annex C (informative) Test piece releasing process Figure C.1 \u2013 Schematic illustration showing the test piece releasing process <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Annex D (informative) Out-of-plane test setup and test piece example Figure D.1 \u2013 Example of test setup and test piece <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Annex E (informative) Data analysis example in in-plane test method Figure E.1 \u2013 Example of CLTE measurement with an aluminium test piece <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Annex F (informative) Data analysis example in out-of-plane test method <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Figure F.1 \u2013 Example of CLTE measurement with a gold test piece <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Micro-electromechanical devices – Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems<\/b><\/p>\n |