IEC 62483:2013 describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This first edition is based on JEDEC documents JESD201A and JESD22-A121A and replaces IEC\/PAS 62483, published in 2006. This first edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) The content of IEC\/PAS 62483 was added to the content of JESD201A as Annex A. b) A methodology was introduced for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers. c) A Clause 6 was introduced detailing the reporting requirements of test results.<\/p>\n
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| 4<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 1 Scope 2 Terms and definitions Figures Figure 1 \u2013 Cross-sectional view of component surface finishes <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | Figure 2 \u2013 Typical photographs of termination corrosion <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | Figure 3 \u2013 Examples of tin whiskers <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | Figure 4 \u2013 Non-whisker surface formations Figure 5 \u2013 Whisker length measurement <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 3 Test method for measuring tin whisker growth 3.1 Procedure 3.2 Test samples Figure 6 \u2013 Minimum lead-to-lead gap <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 3.3 Handling precaution 3.4 Reflow assembly <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 4 Acceptance procedure for tin and tin alloy surface finishes 4.1 Determination of whether a technology, manufacturing process, or similarity acceptance test is required Tables Table 1 \u2013 SMT board assembly process guidance for minimum termination wetting <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | Figure 7 \u2013 Flowchart to determine whether a technology acceptance test,a manufacturing process acceptance test or no testing is requiredon the basis of similarity <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | Figure 8 \u2013 Technology acceptance test flow for multi-leaded components using copperalloy leadframe with post bake mitigation technology \u2013 Surface finish test sample,technology parameters fixed (1 of 2) <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | Figure 8 (2 of 2) <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | Table 2 \u2013 Surface finish technology andmanufacturing process change acceptance parameters <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | Table 3 \u2013 Tin and tin alloy surface finish acceptance test matrix <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | 4.2 Samples 4.2.1 Sample requirements 4.2.2 Sample size for multi-leaded components with 5 or more leads 4.2.3 Sample size for passive and discrete components with 4 leads or fewer 4.2.4 Additional samples <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 4.3 Test procedures and durations 4.3.1 Preconditioning Table 4 \u2013 Tin and tin alloy surface finish acceptance test sample sizerequirements per precondition treatment for multi-leaded component Table 5 \u2013 Tin and tin alloy surface finish acceptance test sample size requirements perprecondition treatment for passive and discrete components with 4 leads or fewer <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 4.3.2 Test conditions 4.3.3 Test durations 4.3.4 Whisker inspection 4.3.5 Surface corrosion observed during high temperature\/humidity testing <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | Table 6 \u2013 Technology acceptance tests and durations <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | Table 7 \u2013 Manufacturing process change acceptance tests and durations <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 4.4 Determination of the class level for testing Table 8 \u2013 Preconditioning for technology\/ manufacturingprocess change acceptance testing <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 5 Acceptance criteria 5.1 General 5.2 Through-hole lead termination exclusions <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | 6 Reporting of results 6.1 General requirements Table 9 \u2013 Technology acceptance criteria for maximum allowable tin whisker length Table 10 \u2013 Manufacturing process change acceptancecriteria for maximum allowable tin whisker length <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | 6.2 Description of the surface finish, defined by technology and process parameters in Table 2 6.3 Samples and preconditioning 6.4 Acceptance testing 7 On-going tin whisker evaluation <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | Annex A (normative) Test method for measuring whisker growth on tin and tin alloy surface finishes of semiconductor devices A.1 Overview A.2 Disclaimer <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | Figure A.1 \u2013 Process flow for Sn whisker testing <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | A.3 Apparatus A.3.1 Temperature cycling chambers A.3.2 Temperature humidity chambers A.3.3 Optical stereomicroscope (optional) A.3.4 Optical microscope (optional) A.3.5 Scanning electron microscope A.3.6 Convection reflow oven (optional) <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | A.4 Validation of optical microscopy equipment A.4.1 Overall criteria A.4.2 Capability of whisker detection <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | A.4.3 Capability of whisker length measurement A.4.4 Capability of whisker density measurement A.5 Sample requirements and optional preconditioning A.5.1 Acceptance requirements <\/td>\n<\/tr>\n | ||||||
| 39<\/td>\n | A.5.2 Scientific studies A.5.3 Test coupons A.5.4 Optional test sample preconditioning <\/td>\n<\/tr>\n | ||||||
| 40<\/td>\n | Table A.2 \u2013 Optional preconditioning treatments for tin whisker test samples Table A.3 \u2013 Optional preconditioning reflow profiles <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | A.6 Whisker inspection, length measurement and test conditions A.6.1 General principles A.6.2 Handling A.6.3 General inspection instructions Figure A.2 \u2013 Optional preconditioning reflow profile <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | A.6.4 Initial pretest inspection A.6.5 Test conditions Figure A.3 \u2013 Examples of whiskers in areas of corrosion Table A.4 \u2013 Tin whisker test conditions <\/td>\n<\/tr>\n | ||||||
| 43<\/td>\n | A.6.6 Screening inspection A.6.7 Detailed inspection <\/td>\n<\/tr>\n | ||||||
| 44<\/td>\n | Figure A.4 \u2013 A schematic diagram depicting a component lead and the top,2 sides, and bends of the lead to be inspected Figure A.5 \u2013 A schematic drawing depicting a leadless componentand the top and 3 sides of the terminations to be inspected Figure A.6 \u2013 A schematic drawing depicting one possible couponand three 1,7 mm2 areas identified for inspection <\/td>\n<\/tr>\n | ||||||
| 45<\/td>\n | A.6.8 Recording procedure for scientific studies Table A.5 \u2013 Tin whisker tests standard report formats (general information) <\/td>\n<\/tr>\n | ||||||
| 47<\/td>\n | Table A.6 \u2013 Tin whisker tests standard report formats (detailed whisker information) <\/td>\n<\/tr>\n | ||||||
| 48<\/td>\n | Table A.7 \u2013 Whisker density ranges that can be determined based onthe number of whiskers observed per lead, termination, or coupon area <\/td>\n<\/tr>\n | ||||||
| 49<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices<\/b><\/p>\n |