IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. This edition includes the following significant technical changes with respect to the previous edition: a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8; b) a definition of the term “stand-off” has been added; c) the methods for locating the datum have been extended to be suitable for SMD-packages; d) the visual identification of terminal position one for automatic handling has been clarified; e) the rules for the drawing of terminals have been clarified; f) Table A.1 has been completed with symbols specifically for SMD-packages; g) Annex B “Standardization philosophy” has been deleted; h) a normative Annex with special rules for SMD-packages has been added; i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 4 General rules for all drawings 4.1 Drawing layout <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 4.2 Dimensions and tolerances <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4.3 Methods for locating the datum <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 4.4 Numbering of terminals 4.4.1 General 4.4.2 Single-ended devices with terminals in a linear array 4.4.3 Single-ended devices with terminals in a circular array 4.4.4 Double-ended devices 4.4.5 Devices with terminals disposed in a square or rectangular periphery 4.4.6 Particular case of lozenge \u2013 shaped bases <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 4.4.7 Other devices 5 Additional rules 5.1 Rules for device and case outline drawings Figures Figure 1 \u2013 Numbering of terminals for the particular case of lozenge \u2013 shaped bases <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 5.2 Rules to specify the dimensions and positions of terminals 5.2.1 General rules 5.2.2 Rules to specify the dimensions and the positions of the terminals on a base drawing 5.3 Rules for gauge drawings Figure 2 \u2013 System to indicate the dimensions of the terminals <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 6 Inter-conversion of inch and millimetre dimensions and rules for rounding off 7 Rules for coding <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | Annex A (informative)Reference letter symbols Table A.1 \u2013 Dimensions of reference letter symbols <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | Annex B (informative)Rules to specify the dimensions and positions of terminalson a base drawing B.1 Example of dimensioning for a circular base outline with no tab and having four terminals located symmetrically on a pitch circle B.1.1 Interpretation of the principle of dimensioning <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | B.1.2 Checking B.2 Example of dimensioning for a circular base outline with a tab and having four terminals located symmetrically on a pitch circle B.2.1 Interpretation of the principle of dimensioning <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | B.2.2 Checking <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | Figure B.1 \u2013 Circular base outline with no tab Figure B.2 \u2013 Tolerances of terminals <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | Figure B.3 \u2013 Gauge for a circular base outline with no tab Figure B.4 \u2013 Circular base outline with tab <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | Figure B.5 \u2013 Gauge for a circular base outline with tab <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | Annex C (normative)General philosophy of flat base devices <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | Figure C.1 ( Example of flat base outline <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | Annex D (normative)Special rules for SMD-packages D.1 General reference D.2 Lead terminals D.3 Measuring methods <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | Annex E (informative)Examples of semiconductor device drawings Figure E.1 \u2013 Long form package Figure E.2 \u2013 Post\/stud mount package <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | Figure E.3 \u2013 Cylindric package <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | Figure E.4 \u2013 Cylindric in-line package Figure E.5 \u2013 Flange-mounted in-line package <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | Figure E.6 \u2013 Press package Figure E.7 \u2013 SMD-package with flat leads <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | Figure E.8 \u2013 SMD-Package with gull-wing leads <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | Figure E.9 \u2013 SMD-package with no leads <\/td>\n<\/tr>\n | ||||||
| 39<\/td>\n | Annex F (informative)Former rules for rounding off F.1 Toleranced dimensions F.1.1 Maximum and minimum values of toleranced dimensions F.1.2 Nominal value of toleranced dimensions F.2 Untoleranced dimensions (maximum only or minimum only) F.3 Untoleranced nominal dimensions given for general information <\/td>\n<\/tr>\n | ||||||
| 40<\/td>\n | F.4 Untoleranced nominal dimensions given to specify true geometrical positions <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | Annex G (informative)Former rules for coding G.1 General G.2 Device outlines G.3 Bases G.4 Case outlines G.5 Type variants and provisional drawings <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of discrete devices<\/b><\/p>\n |