{"id":247916,"date":"2024-10-19T16:19:30","date_gmt":"2024-10-19T16:19:30","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-62572-32014\/"},"modified":"2024-10-25T11:27:45","modified_gmt":"2024-10-25T11:27:45","slug":"bs-en-62572-32014","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-62572-32014\/","title":{"rendered":"BS EN 62572-3:2014"},"content":{"rendered":"<p>This part of <span class=\"std\"> <span class=\"std-ref\">IEC&nbsp;62572<\/span> <\/span> deals with reliability assessment of laser modules used for telecommunication.<\/p>\n<p>The aim of this standard is<\/p>\n<ul>\n<li>\n<p>to establish a standard method of assessing the reliability of laser modules in order to minimize risks and to promote product development and reliability;<\/p>\n<\/li>\n<li>\n<p>to establish means by which the distribution of failures with time can be determined. This should enable the determination of equipment failure rates for specified end of life criteria.<\/p>\n<\/li>\n<\/ul>\n<p>In addition, guidance is given in <span class=\"std\"> <span class=\"std-ref\">IEC&nbsp;TR&nbsp;62572\u20112<\/span> <\/span>.<\/p>\n<h4>PDF Catalog<\/h4>\n<table border=\"1px\" class=\"des-table\">\n<tr>\n<th>PDF Pages<\/th>\n<th>PDF Title<\/th>\n<\/tr>\n<tr>\n<td><b>6<b><\/td>\n<td>English  <br \/> CONTENTS  <\/td>\n<\/tr>\n<tr>\n<td><b>7<b><\/td>\n<td>INTRODUCTION  <\/td>\n<\/tr>\n<tr>\n<td><b>8<b><\/td>\n<td>1 Scope <br \/> 2 Normative references  <\/td>\n<\/tr>\n<tr>\n<td><b>9<b><\/td>\n<td>3 Terms, definitions, symbols and abbreviations <br \/> 3.1 Terms and definitions  <\/td>\n<\/tr>\n<tr>\n<td><b>10<b><\/td>\n<td>3.2 Symbols and abbreviations <br \/> 4 Laser reliability and quality assurance procedure <br \/> 4.1 Demonstration of product quality  <\/td>\n<\/tr>\n<tr>\n<td><b>11<b><\/td>\n<td>4.2 Testing responsibilities <br \/> 4.2.1 General <br \/> 4.2.2 Recommendation applicable to laser customer\/system supplier <br \/> 4.2.3 Recommendation applicable to system operator <br \/> 4.3 Quality improvement programmes (QIPs) <br \/> 5 Tests <br \/> 5.1 General  <\/td>\n<\/tr>\n<tr>\n<td><b>12<b><\/td>\n<td>5.2 Structural similarity <br \/> 5.3 Burn-in and screening (when applicable in the specification) <br \/> Tables <br \/> Table 1 \u2013 Initial qualification   <\/td>\n<\/tr>\n<tr>\n<td><b>14<b><\/td>\n<td>Table 2 \u2013 Maintenance of qualification  <\/td>\n<\/tr>\n<tr>\n<td><b>15<b><\/td>\n<td>6 Activities <br \/> 6.1 Analysis of reliability results  <\/td>\n<\/tr>\n<tr>\n<td><b>16<b><\/td>\n<td>6.2 Technical visits to LMMs <br \/> 6.3 Design\/process changes <br \/> 6.4 Deliveries <br \/> 6.5 Supplier documentation <br \/> Table 3 \u2013 Performance for laser module reliability parameters  <\/td>\n<\/tr>\n<tr>\n<td><b>17<b><\/td>\n<td>Annex A  (informative)  Guidance on testing in Table 1 and Table 2 <br \/> A.1 Laser module life tests containing thermoelectric coolers (for example, Peltier, test 1.1, Table 1) <br \/> A.2 Laser module life tests \u2013 Uncooled modules (test 1.2, Table 1) <br \/> Table A.1 \u2013 Recommended life test conditions for laser modulescontaining Peltier coolers  <\/td>\n<\/tr>\n<tr>\n<td><b>18<b><\/td>\n<td>A.3 Laser diode life tests on submounts (test 1.3, Table 1) <br \/> A.4 Monitor photodiode life tests (test 1.4, Table 1) <br \/> Table A.2 \u2013 Recommended life test conditions for uncooled laser modules <br \/> Table A.3 \u2013 Recommended laser diode life test conditions  <\/td>\n<\/tr>\n<tr>\n<td><b>19<b><\/td>\n<td>A.5 Temperature cycling and thermal shock (test 3, Table 1 and Test 2, Table 2) <br \/> A.6 Sealing\/hermeticity (test 4, Table 1 and test 3, Table 2) <br \/> A.7 Shock and vibration (test 5, Table 1 and test 4, Table 2) <br \/> A.8 High-temperature storage (test 6, Table 1 and test 5, Table 2) <br \/> Table A.4 \u2013 Recommended photodiode life test conditions  <\/td>\n<\/tr>\n<tr>\n<td><b>20<b><\/td>\n<td>A.9 Electrostatic discharge sensitivity (ESD) (test 7, Table 1 and test 6, Table 2) <br \/> A.10 Residual gas analysis (RGA) (test 8, Table 1 and test 7, Table 2)  <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p><b>Fibre optic active components and devices. Reliability standards &#8211; Laser modules used for telecommunication<\/b><\/p>\n<table class=\"shortdes-table\" style=\"width: 100%\" border=\"0\" cellspacing=\"0\" cellpadding=\"0\">\n<tbody>\n<tr>\n<td>Published By<\/td>\n<td>Publication Date<\/td>\n<td>Number of Pages<\/td>\n<\/tr>\n<tr>\n<td><a href=\"https:\/\/pdfstandards.shop\/product-category\/publishers\/bsi\/\"><b>BSI<\/b><\/a><\/td>\n<td>2014<\/td>\n<td>22<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":247919,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[652,2641],"product_tag":[],"class_list":{"0":"post-247916","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-33-180-99","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/247916","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/247919"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=247916"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=247916"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=247916"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}