IEC 60317-35:2013 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE – A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: – Grade 1B: 0,020 mm up to and including 0,800 mm; – Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: – new 3.2.2 containing general notes on winding wire, formerly a part of the scope; – revision to references to IEC 60317-0-1:2013 to clarify that their application is normative; – modification to Clause 15 to remove specific wire specimen sizes; – consolidation of 17.1 and 17.2 of the solderability requirements; – new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | 1 Scope 2 Normative references 3 Terms, definitions, general notes and appearance 3.1 Terms and definitions 3.2 General notes 3.2.1 Test methods 3.2.2 Winding wire <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 3.3 Appearance 4 Dimensions 5 Electrical resistance 6 Elongation 7 Springiness 8 Flexibility and adherence 9 Heat shock 10 Cut-through 11 Resistance to abrasion (nominal conductor diameters from 0,250\u00a0mm up to and including 0,800\u00a0mm) <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 12 Resistance to solvents 13 Breakdown voltage 14 Continuity of insulation 15 Temperature index 16 Resistance to refrigerants 17 Solderability 17.1 Nominal conductor diameters up to and including 0,100\u00a0mm Table 1 \u2013 Resistance to abrasion <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 17.2 Nominal conductor diameters over 0,100\u00a0mm 18 Heat or solvent bonding 18.1 Heat bonding 18.1.1 Heat bonding strength of a helical coil <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 18.1.2 Bond strength of a twisted coil 18.2 Solvent bonding Table 2 \u2013 Loads <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 19 Dielectric dissipation factor 20 Resistance to transformer oil 21 Loss of mass 23 Pin hole test 30 Packaging <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Specifications for particular types of winding wires – Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer<\/b><\/p>\n |